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1. product profile 1.1 general description n-channel enhancement mode field-effect transistor (fet) in a small sot23 (to-236ab) surface-mounted device (smd) plastic package using trench mosfet technology. 1.2 features and benefits ? aec-q101 qualified ? logic-level compatible ? trench mosfet technology ? very fast switching 1.3 applications ? high-speed line driver ? low-side loadswitch ? relay driver ? switching circuits 1.4 quick reference data [1] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for drain 1 cm 2 . 2N7002P 60 v, 360 ma n-channel trench mosfet rev. 02 ? 29 july 2010 product data sheet table 1. quick reference data symbol parameter conditions min typ max unit v ds drain-source voltage t amb =25c --60v v gs gate-source voltage -20 - 20 v i d drain current v gs =10v; t amb =25c [1] --360ma static characteristics r dson drain-source on-state resistance v gs =10v; i d =500ma; t j = 25 c; pulsed; t p 300 s; ? 0.01 -11.6 ?
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 2 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 2. pinning information 3. ordering information 4. marking [1] % = -: made in hong kong; % = p: made in hong kong; % = t: made in malaysia; % = w: made in china 5. limiting values [1] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for drain 1 cm 2 . table 2. pinning information pin symbol description simplified outline graphic symbol 1 g gate sot23 (to-236ab) 2ssource 3 d drain 12 3 s d g m bb076 table 3. ordering information type number package name description version 2N7002P to-236ab plastic surface-mounted package; 3 leads sot23 table 4. marking codes type number marking code [1] 2N7002P lw% table 5. limiting values in accordance with the absolute maxi mum rating system (iec 60134). symbol parameter conditions min max unit v ds drain-source voltage t amb =25c - 60 v v gs gate-source voltage -20 20 v i d drain current v gs =10v; t amb =25c [1] - 360 ma v gs =10v; t amb = 100 c [1] - 280 ma i dm peak drain current t amb = 25 c; single pulse; t p 10 s - 1.2 a p tot total power dissipation t amb =25c [2] - 350 mw [1] - 420 mw t sp =25c - 1140 mw t j junction temperature - 150 c t amb ambient temperature -55 150 c t stg storage temperature -65 150 c source-drain diode i s source current t amb =25c [1] - 360 ma
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 3 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. fig 1. normalized total power dissipation as a function of ambient temperature fig 2. normalized continuous drain current as a function of ambi ent temperature i dm = single pulse (1) t p = 100 s (2) t p = 1 ms (3) t p = 10 ms (4) t p = 100 ms (5) dc; t sp = 25 c (6) dc; t amb = 25 c; drain mounting pad 1 cm 2 fig 3. safe operating area; junction to ambient; continuo us and peak drain currents as a function of drain-source voltage t amb ( c) ? 75 175 125 25 75 ? 25 017aaa001 40 80 120 p der (%) 0 t amb ( c) ? 75 175 125 25 75 ? 25 017aaa002 40 80 120 i der (%) 0 017aaa014 10 ? 1 10 ? 2 1 10 i d (a) 10 ? 3 v ds (v) 10 ? 1 10 2 10 1 (1) (2) (3) (4) (5) (6)
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 4 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 6. thermal characteristics [1] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided c opper, tin-plated, mounting pad for drain 1 cm 2 . table 6. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] - 310 370 k/w [2] - 260 300 k/w r th(j-sp) thermal resistance from junction to solder point --115k/w fr4 pcb, standard footprint fig 4. transient thermal impedance from junction to ambient as a function of pulse duration; typical values fr4 pcb, mounting pad for drain 1 cm 2 fig 5. transient thermal impedance from junction to ambient as a function of pulse duration; typical values 017aaa015 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0 017aaa016 t p (s) 10 ? 3 10 2 10 3 10 1 10 ? 2 10 ? 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0.02 0.01 0
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 5 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 7. characteristics table 7. characteristics symbol parameter conditions min typ max unit static characteristics v (br)dss drain-source breakdown voltage i d =10a; v gs =0v; t j =25c 60--v v gsth gate-source threshold voltage i d =250a; v ds =v gs ; t j = 25 c 1.1 1.75 2.4 v i dss drain leakage current v ds =60v; v gs =0v; t j =25c --1a v ds =60v; v gs =0v; t j =150c --10a i gss gate leakage current v gs =20v; v ds =0v; t j = 25 c - - 100 na v gs =-20v; v ds =0v; t j = 25 c - - 100 na r dson drain-source on-state resistance v gs =5v; i d = 50 ma; pulsed; t p 300 s; ? 0.01 ; t j =25c -1.32 ? v gs =10v; i d = 500 ma; pulsed; t p 300 s; ? 0.01 ; t j =25c -11.6 ? g fs forward transconductance v ds =10v; i d = 200 ma; pulsed; t p 300 s; ? 0.01 ; t j =25c - 400 - ms dynamic characteristics q g(tot) total gate charge i d =300ma; v ds =30v; v gs =4.5v; t j =25c -0.60.8nc q gs gate-source charge - 0.2 - nc q gd gate-drain charge - 0.2 - nc c iss input capacitance v gs =0v; v ds =10v; f=1mhz; t j =25c - 3050pf c oss output capacitance - 7 - pf c rss reverse transfer capacitance -4-pf t d(on) turn-on delay time v ds =50v; r l = 250 ? ; v gs =10v; r g(ext) =6 ? ; t j =25c - 36ns t r rise time - 4 - ns t d(off) turn-off delay time - 10 20 ns t f fall time -5-ns source-drain diode v sd source-drain voltage i s =115ma; v gs =0v; t j = 25 c 0.47 0.75 1.1 v
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 6 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet t amb = 25 c t amb = 25 c; v ds = 5 v (1) minimum values (2) typical values (3) maximum values fig 6. output characteristics: drain current as a function of drain-source voltage; typical values fig 7. sub-threshold drain current as a function of gate-source voltage t amb = 25 c (1) v gs = 3.25 v (2) v gs = 3.5 v (3) v gs = 4 v (4) v gs = 5 v (5) v gs = 10 v i d = 500 ma (1) t amb = 150 c (2) t amb = 25 c fig 8. drain-source on-state resistance as a function of drain current; typical values fig 9. drain-source on-state resistance as a function of gate-source voltage; typical values v ds (v) 0.0 4.0 3.0 1.0 2.0 017aaa017 0.4 0.5 0.3 0.2 0.1 0.6 0.7 i d (a) 0.0 3.5 v v gs = 4.0 v 3.0 v 2.75 v 2.5 v 3.25 v 017aaa018 v gs (v) 03 2 1 10 ? 4 10 ? 5 10 ? 3 i d (a) 10 ? 6 (2) (1) (3) i d (a) 0.0 1.0 0.8 0.4 0.6 0.2 017aaa019 5.0 2.5 7.5 10.0 r dson ( ) 0.0 (2) (1) (3) (4) (5) v gs (v) 0.0 10.0 8.0 4.0 6.0 2.0 017aaa020 2.0 4.0 6.0 r dson ( ) 0.0 (1) (2)
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 7 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet v ds > i d r dson (1) t amb = 25 c (2) t amb = 150 c fig 10. transfer characteristics: drain current as a function of gate-source voltage; typical values fig 11. normalized drain-source on-state resistance as a function of ambient temperature; typical values i d = 0.25 ma; v ds = v gs (1) maximum values (2) typical values (3) minimum values f = 1 mhz; v gs = 0 v (1) c iss (2) c oss (3) c rss fig 12. gate-source threshold voltage as a function of ambient temperature fig 13. input, output and reverse transfer capacitances as a function of drain-source voltage; typical values v gs (v) 0.0 5.0 4.0 2.0 3.0 1.0 017aaa021 0.4 0.6 0.2 0.8 1.0 i d (a) 0.0 (1) (2) (2) (1) t amb ( c) ? 60 180 120 060 017aaa022 1.2 0.6 1.8 2.4 a 0.0 t amb ( c) ? 60 180 120 060 017aaa023 1.0 2.0 3.0 v gs(th) (v) 0.0 (2) (1) (3) 017aaa024 v ds (v) 10 ? 1 10 2 10 1 10 10 2 c (pf) 1 (2) (1) (3)
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 8 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet i d = 300 ma; v ds = 30 v; t amb = 25 c fig 14. gate-source voltage as a function of gate charge; typical values fig 15. gate charge waveform definitions v gs = 0 v (1) t amb = 150 c (2) t amb = 25 c fig 16. source current as a function of source-drain voltage; typical values q g (nc) 0.0 0.8 0.6 0.2 0.4 017aaa025 2.0 3.0 1.0 4.0 5.0 v gs (v) 0.0 003aaa508 v gs v gs(th) q gs1 q gs2 q gd v ds q g(tot) i d q gs v gs(pl) v sd (v) 0.0 1.2 0.8 0.4 017aaa026 0.4 0.8 1.2 i s (a) 0.0 (1) (2)
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 9 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 8. test information fig 17. duty cycle definition t 1 t 2 p t 006aaa812 duty cycle = t 1 t 2
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 10 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 9. package outline fig 18. package outline sot23 (to-236ab) unit a 1 max. b p cd e e 1 h e l p qw v references outline version european projection issue date 04-11-04 06-03-16 iec jedec jeita mm 0.1 0.48 0.38 0.15 0.09 3.0 2.8 1.4 1.2 0.95 e 1.9 2.5 2.1 0.55 0.45 0.1 0.2 dimensions (mm are the original dimensions) 0.45 0.15 sot23 to-236ab b p d e 1 e a a 1 l p q detail x h e e w m v m a b a b 0 1 2 mm scale a 1.1 0.9 c x 12 3 plastic surface-mounted package; 3 leads sot2 3
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 11 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 10. soldering fig 19. reflow soldering footprint for sot23 (to-236ab) fig 20. wave soldering footprint for sot23 (to-236ab) solder lands solder resist occupied are a solder paste sot023_ fr 0.5 (3 ) 0.6 (3 ) 0.6 (3 ) 0.7 (3 ) 3 1 3.3 2.9 1.7 1.9 2 dimensions in mm solder lands solder resist occupied are a preferred transport direction during soldering sot023_ fw 2.8 4.5 1.4 4 .6 1.4 (2 ) 1.2 (2 ) 2.2 2.6 dimensions in mm
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 12 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 11. revision history table 8. revision history document id release date data sheet status change notice supersedes 2N7002P v.2 20100729 product data sheet - 2N7002P_1 modifications: ? correction of thermal values. ? correction of various characteristics values including related graphs. 2N7002P_1 20100419 product data sheet - -
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 13 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term 'short data sheet' is explained in section "definitions". [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objective specification for product development. preliminary [short] data sheet qualific ation this document contains data fr om the preliminary specification. product [short] data sheet production this doc ument contains the product specification.
2N7002P all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 02 ? 29 july 2010 14 of 15 nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any licens e under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulati ons. export might require a prior authorization from national authorities. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. adelante , bitport , bitsound , coolflux , coreuse , desfire , ez-hv , fabkey , greenchip , hipersmart , hitag , i2c-bus logo, icode , i-code , itec , labelution , mifare , mifare plus , mifare ultralight , moreuse , qlpak , silicon tuner , siliconmax , smartxa , starplug , topfet , trenchmos , trimedia and ucode ? are trademarks of nxp b.v. hd radio and hd radio logo ? are trademarks of ibiquity digital corporation. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors 2N7002P 60 v, 360 ma n-channel trench mosfet ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 july 2010 document identifier: 2N7002P please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.1 general description . . . . . . . . . . . . . . . . . . . . . .1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . .1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . .1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . .2 3 ordering information . . . . . . . . . . . . . . . . . . . . . .2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2 6 thermal characteristics . . . . . . . . . . . . . . . . . . .4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .5 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . .9 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . .10 10 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . .12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . .13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . .13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14 13 contact information. . . . . . . . . . . . . . . . . . . . . .14

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